Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black							Die		Wire Bond - Au		Capacitor									Laminate Board																			Resistor															Solder Paste							TOTAL
					Epoxy resin [%]	Phenol Resin [%]	Metal Hydroxide [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Titanium Dioxide (TiO2) [%]	Boron Trioxide (B2O3) [%]	Tin (Sn) [%]	Silica Amorphous (SiO2) [%]	Misc. [%]	Barium Monoxide (BaO) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Defoamers [%]	Phthalocyanine blue [%]	Organic Filler [%]	Acrylate resin [%]	Diproplyeneglycolmonomethylether [%]	Cured Thermosetting Resin [%]	Silica [%]	Talc [%]	3-methoxy-3-methylbutylacetate [%]	Naphthalene [%]	Fiber Glass (SiO2) [%]	Photoinitiator [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Solvent Naphtha (Solvent oil) [%]	Copper (Cu) [%]	Barium Sulfate (BaSO4) [%]	Weight [mg]	C.I. Pigment Black [%]	Epoxy Resin [%]	Glass Frit [%]	Boron (B) [%]	Silver (Ag) [%]	Tin (Sn) [%]	Bismuth Trioxide (Bi2O3) [%]	Magnesium Monoxide (MgO) [%]	Silica Amorphous (SiO2) [%]	Palladium (Pd) [%]	Aluminum Trioxide (Al2O3) [%]	Ruthenium Oxide (RuO2) [%]	Fused Silica (SiO2) [%]	Nickel (Ni) [%]	Weight [mg]	2-(2-Hexyloxyethoxy) ethanol [%]	Denatured Acid Hydrogenation Rosin [%]	Dimer Acid [%]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
					proprietary data	proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-21-3	n/a	7440-57-5	n/a	13463-67-7	1303-86-2	7440-31-5	7631-86-9	proprietary data	1304-28-5	7440-02-0	7440-50-8	n/a	n/a	n/a	n/a	n/a	34590-97-8	proprietary data	proprietary data	14807-96-6	103429-90-9	91-20-3	65997-17-3	proprietary data	7440-05-3	7440-02-0	7440-57-5	64742-94-5	7440-50-8	7727-43-7	n/a	68186-91-4	25068-38-6	65997-18-4	7440-42-8	7440-22-4	7440-31-5	1304-76-3	1309-48-4	7631-86-9	7440-05-3	1344-28-1	12036-10-1	60676-86-0	7440-02-0	n/a	112-59-4	proprietary	proprietary	7440-22-4	7440-31-5	7440-50-8	n/a	n/a
RHYTHM R3910	R3910-CFAB-E1B	Obsolete	Y		No data available
RHYTHM R3910	R3910-CFAB-E1T	Lifetime	Y	7c	8	5	1	25	1	60	14.5	100	4.889605	100	0.647515	16.3333	0.6444	7.7778	2.5778	5.4444	32.6667	5.5556	29	0.9	0.001544381	0.03334904	0.03334904	2.327360909	0.005034307	15.38888889	2.17756E-4	0.166289597	0.010123052	8.91114E-4	15.3888889	0.001544381	0.001455595	0.002455587	9.99992E-4	0.001544381	64.6413358	1.994727276	36.8302955	1.2786	0.836	0.0492	0.0738	3.467	6.688	0.6393	1.4507	1.4507	0.2459	69.8795	1.0573	0.1229	12.9825	0.04067	4	4	2	3	86	1	3.089286	60.8973715

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.